| abstract |
A MEMS package and a method for forming the same will be described. The MEMS package has at least one MEMS device disposed on a flexible substrate. The metal structure surrounds at least one MEMS device, the bottom surface of the metal structure is attached to a flexible substrate, and a portion of the flexible substrate is folded over the top surface of the metal structure and attached to the top surface of the metal structure. Thereby, the MEMS package is configured. |