| abstract |
Provided is a photosensitive resin composition that can be used for applications such as an interlayer insulating film, which can form an image with a thick film and has a sufficiently low water absorption. SOLUTION: (A) a polyamic acid having an alkylene chain or alicyclic skeleton having 5 to 20 carbon atoms in the main chain, (B) a photopolymerizable compound having a vinyl group-containing epoxy resin, and (C) photopolymerization. A photosensitive resin composition comprising an initiator. [Selection figure] None |