http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009289909-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2008-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1d3d1b364a01ae7be164af54b7fb68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d2d88576d15adc19578a4e976b17b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ca262557333d8e21ce3282b8adddd66 |
| publicationDate | 2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009289909-A |
| titleOfInvention | Multilayer circuit board manufacturing method |
| abstract | Provided is a method for manufacturing a multilayer circuit board capable of increasing the adhesion strength between a wiring and an insulating resin film while avoiding a patterning defect due to miniaturization. A foil 6 having an adhesive material 5 provided on at least one surface is pasted on a circuit 3 with an insulating resin film 4 facing the adhesive material 5 toward the support substrate 1 side. A copper foil or the like is used as the foil 6, and a film generated by chromate treatment is used as the adhesion material 5. Thereafter, an opening 6a is formed, and a via hole 7 is further formed. At this time, since smear is inevitably generated at the bottom of the via hole 7, the smear is removed thereafter. Next, the protection part 9 which shows water repellency is provided in the surface of the circuit 3 by performing the surface treatment of the circuit 3 containing copper using the solution containing the substance which reacts with copper and shows water repellency. Next, the protection part 9 on the foil 6 is removed while the protection part 9 on the circuit 3 is left, and the foil 6 is also removed. Then, the protection part 9 on the circuit 3 is removed, and wiring is formed in the via hole 7 and on the adhesion material 5. [Selection] Figure 2H |
| priorityDate | 2008-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.