http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009286845-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2008-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0192bba9f0b76f20fafe36f4208ead5b |
| publicationDate | 2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009286845-A |
| titleOfInvention | Epoxy resin composition for sealing and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for sealing, which has excellent adhesion to a lead frame and can provide a highly reliable semiconductor device even when a nickel-plated lead frame is used, and a semiconductor device using the same. A sealing epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components, wherein the following general formula (I): [Chemical 1] (Wherein R represents an alkyl group having 8 to 14 carbon atoms or a phenyl group), and is characterized by containing a trimellitic acid salt of an imidazole compound. [Selection figure] None |
| priorityDate | 2008-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.