| abstract |
An epoxy resin composition for sealing capable of effectively suppressing warping of a package even in a thin semiconductor device such as an area array type package and having excellent storage stability and a semiconductor device using the same I will provide a. A sealing epoxy resin composition containing an epoxy resin, a curing agent having a phenolic hydroxyl group, a curing accelerator, and an inorganic filler as essential components, and 2,4-diamino- as a curing accelerator. It contains 6- (2'-methylimidazolyl- (1 '))-ethyl-s-triazine isocyanuric acid adduct. [Selection figure] None |