| abstract |
A protective film that can be easily cut by a dicer and does not cause chipping of a wafer. In a protective film for a semiconductor wafer comprising a base film and a protective layer provided on one side of the base film, The protective layer is 100 parts by mass of at least one selected from the group consisting of (A) a phenoxy resin, a polyimide resin, and a (meth) acrylic resin, (B) 5 to 200 parts by mass of an epoxy resin, (C) 100-400 parts by weight of filler, (D) a catalytic amount of an epoxy resin curing catalyst, 10 to 100 parts by mass of the filler (C) is a silicone rubber fine particle coated with a polyorganosilsesquioxane resin. [Selection figure] None |