| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2009-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5358f956aa40d000d46e404b05591c1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_216323f9523da86c9b3fd455e6e912f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd4f189cfac304c3273283d0a8ba8c14 |
| publicationDate |
2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009283925-A |
| titleOfInvention |
Dicing tape integrated adhesive sheet, dicing tape integrated adhesive sheet manufacturing method, and semiconductor device manufacturing method |
| abstract |
Disclosed are a dicing tape integrated adhesive sheet, a dicing tape integrated adhesive sheet manufacturing method, and a semiconductor device manufacturing method capable of cutting a soft and easily stretchable adhesive sheet together with a semiconductor wafer with good breakability. A dicing tape-integrated adhesive sheet 3 includes an adhesive sheet 1 containing at least a high molecular weight component, and a dicing tape 2 laminated on the adhesive sheet 1. The elongation at break of the adhesive sheet 1 in the B stage state at 25 ° C. is more than 40%. The elastic modulus of the adhesive sheet 1 in the B stage state by dynamic viscoelasticity measurement at 25 ° C. and 900 Hz is less than 4000 MPa. The dicing tape 2 does not show a yield point during tensile deformation. The ratio A / B between the thickness A of the dicing tape 2 and the thickness B of the adhesive sheet 1 is 2 to 30. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9142457-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012028050-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013214600-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021084778-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102222633-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012222002-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101751049-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130111994-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011228399-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011171588-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103367219-A |
| priorityDate |
2008-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |