http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009279770-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-08
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C43-14
filingDate 2008-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb61e5f3269b6e0d479d25a1e7c20a38
publicationDate 2009-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009279770-A
titleOfInvention LAMINATED MANUFACTURING METHOD, LAMINATED PLATE, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR DEVICE
abstract The present invention provides a method for manufacturing a laminated board, a laminated board, a circuit board, a semiconductor package substrate, and a semiconductor device, which have high heat resistance and are free from distortion in a thermal process during component mounting. A method of manufacturing a laminated board in which a predetermined number of prepregs impregnated with a resin component on a base material are stacked and heat-press molded, comprising: a first step of molding at a high pressure; A second step of molding at a low pressure, and when the degree of cure of the resin component by DSC is 30% or more and 90% or less, the first step is switched to the second step, It is the manufacturing method of the laminated board to do. [Selection] Figure 1
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priorityDate 2008-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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