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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
filingDate 2009-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_450fa2de380cb61d24aecd90453a582d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2834ee240e8610258e28fbc50ca61047
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publicationDate 2009-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009274441-A
titleOfInvention Structure and manufacturing method of structure
abstract Disclosed is an electric circuit structure sandwiched between polyarylene sulfides having excellent adhesiveness without deteriorating the excellent properties of polyarylene sulfides without using an adhesive. A structure characterized in that an element made of a conductor is sandwiched and fixed between polyarylene sulfide films without using an adhesive. Further, the structure is characterized by being laminated by thermocompression bonding at a temperature not lower than the melting point (Tm) -20 ° C. of the copolymerized polyphenylene sulfide layer (AC) and not higher than the melting point (Tm) of the polyarylene sulfide film (A). And is laminated by thermocompression bonding at a temperature not lower than the melting point (Tm) -20 ° C. of the copolymerized polyphenylene sulfide layer (BC) and not higher than the melting point (Tm) of the polyarylene sulfide film (B). A structure manufacturing method characterized by the above. [Selection figure] None
priorityDate 2008-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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