http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009272507-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2008-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53aae9c6864cf52d66d6598e1473e96 |
| publicationDate | 2009-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009272507-A |
| titleOfInvention | Heat dissipation structure, heat dissipation device, and manufacturing method of heat dissipation structure |
| abstract | An object of the present invention is to provide a heat dissipation structure having excellent thermal conductivity and high heat dissipation performance at low cost. A heat dissipation structure according to the present invention includes at least a substrate, and a hole bottom surface formation layer obtained by removing a hole side surface formation layer of a template layer formed on at least one surface of the substrate; A plurality of fibrous carbon precursors or carbon structures grown from the hole bottom surface forming layer, wherein the plurality of carbon precursors or carbon structures are oriented in a direction substantially perpendicular to the substrate surface. A layer having a carbon precursor or a carbon structure is formed. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9839862-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014524984-A |
| priorityDate | 2008-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.