http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009267305-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B31-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01F7-30 |
filingDate | 2008-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c53aae9c6864cf52d66d6598e1473e96 |
publicationDate | 2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2009267305-A |
titleOfInvention | Heat dissipation structure, heat spreader, and manufacturing method of heat dissipation structure |
abstract | An object of the present invention is to provide a heat dissipation structure having a low thermal resistance even when the composite material having a low surface roughness is used as a substrate. A heat dissipation structure according to the present invention is characterized in that a substrate made of a composite material containing at least carbon and aluminum, and a layer mainly composed of whiskers are formed on the surface of the substrate. The whisker is an aluminum carbide whisker or an alumina whisker, and is preferably grown so as to extend directly from the substrate surface to the outside. The substrate is characterized by being an Al-SiC, Al-carbon, or Al-diamond based composite material. [Selection] Figure 1 |
priorityDate | 2008-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.