http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009267029-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
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filingDate 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_038f1bfef683eed9cab856bd3d1da531
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fccc9b84ca02f714fd06f8feb07a6cf
publicationDate 2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009267029-A
titleOfInvention Nitride semiconductor device and method for manufacturing nitride semiconductor device
abstract PROBLEM TO BE SOLVED: To provide a nitride semiconductor element and its manufacturing method in which the resistance of a group III nitride semiconductor is reduced to the maximum without depending on the type of a gate insulating film. A nitride semiconductor device includes an n − -type GaN drift layer 6, a p-type GaN channel layer 3 and an n + -type GaN source layer 4 and a trench 7 straddling these layers. The laminated structure portion 1 is formed. A gate insulating film 11 is formed on the inner side wall 8 and the inner bottom wall 9 of the nitride semiconductor multilayer structure portion 1 facing the trench 7. At least an n − -type GaN drift is formed on the gate insulating film 11 with the gate insulating film 11 interposed therebetween. A gate electrode 12 facing the layer 6 and the p-type GaN channel layer 3 is formed. Then, a p-type GaN layer 10 is formed on the inner bottom wall 9 of the n − -type GaN drift layer 6 so as to face the gate electrode 12 with the gate insulating film 11 interposed therebetween. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102184956-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014192174-A
priorityDate 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.