| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate |
2008-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d1659b3f1382f2b477678713d4fe4fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0fe833ffda8089577b42b1ae771e27a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07c99123818ffc3164a400e7c947a163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95af9050666b7013665e0a1d5c413ccb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098fade92ab809179dc4e98a74550d3b |
| publicationDate |
2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009263620-A |
| titleOfInvention |
Adhesive film for semiconductor |
| abstract |
The present invention provides an adhesive film capable of sufficiently lowering the temperature when affixed to the back surface of a wafer and easily peeling from a dicing sheet in a pickup process. An adhesive film for a semiconductor according to the present invention includes a first adhesive layer containing a first polyimide resin having a glass transition temperature of 0 ° C. or higher and lower than 40 ° C., and a glass transition temperature of 40 ° C. or higher. A second adhesive layer 1b containing a second polyimide resin having a temperature of less than 80 ° C. and formed on one surface of the first adhesive layer 1a. [Selection] Figure 1 |
| priorityDate |
2008-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |