http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009260224-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6676acb826e82e48899dd73b5e127908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_098fade92ab809179dc4e98a74550d3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6542bb7a0e2a09022a466ede6627fdff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de07f14bc25508907c9b0499473c5fda |
| publicationDate | 2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009260224-A |
| titleOfInvention | Semiconductor wafer dicing method and semiconductor device manufacturing method |
| abstract | A semiconductor device manufacturing method capable of easily manufacturing a semiconductor device and excellent in productivity is provided. A method of manufacturing a semiconductor device according to the present invention includes a step of forming an insulating resin layer 12 covering a plurality of protruding electrodes 10a on a circuit surface S1, and a dicing frame 14 and a dicing tape 16 for the semiconductor wafer 10. A step of attaching the semiconductor wafer 10 to the plurality of semiconductor chips 20 by dicing the semiconductor wafer 10 and the insulating resin layer 12 from the circuit surface S1 side of the semiconductor wafer 10; In a state where the protruding electrode 10a of the semiconductor chip 20 and the circuit electrode on the substrate are held by the alignment head, a step of temporarily fixing and fixing the semiconductor chip 20 and the substrate using the connection head are performed. And a step of electrically connecting the protruding electrode 10a of the semiconductor chip 20 and the circuit electrode of the substrate. [Selection] Figure 4 |
| priorityDate | 2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.