| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e78acdb66e206d602c5d56a0c69981ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51de130ff60cbe7e1a3b4161553f96b9 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2008-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ff309f928f7c585837ce61f484896ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b4e031a3485134f2a48426371258a71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c2973bfc6dd8e0dc1b842343f53ee29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9078b67d1507bb79aadac79cb1f191e4 |
| publicationDate |
2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009256730-A |
| titleOfInvention |
Surface treatment method for electronic parts |
| abstract |
A surface treatment method for applying tin plating and tin alloy plating to suppress whisker generation on a terminal surface of a printed wiring board or the like or a terminal surface of an electronic component is provided. Printed wiring boards, etc. using a plating solution containing organic sulfonic acid, divalent tin salt of organic sulfonic acid, nonionic surfactant, organic chlorine compound and organic chlorine aldehyde compound as essential components The surface of the electronic component terminal is electroplated to form a whisker-preventing plating layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2749672-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9926637-B2 |
| priorityDate |
2008-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |