| abstract |
PROBLEM TO BE SOLVED: To provide a silicone adhesive for a semiconductor element having high concealability, effectively reflecting light emitted from an LED chip, having good chip fit, high adhesive strength, and excellent durability. I will provide a. A) The viscosity is 100 Pa. At 25 ° C. an addition reaction curable silicone resin composition having a type D hardness of 30 degrees or more as defined in JIS K6253 of a cured product obtained by heating at 150 ° C. for 3 hours, b) a white pigment powder having an average particle diameter of less than 1 μm, and c) a white or colorless and transparent powder having an average particle diameter of 1 μm or more and less than 10 μm, and the sum of b) component and c) component is 100 masses of component a). The silicone adhesive for semiconductor elements which is 12-600 mass parts with respect to a part. [Selection figure] None |