| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-751
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2008-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8c56d312e2a003c6452bf9d089744a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d319aeddc30a534bf2514d3a476f6a02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec77a6c08dc09e70c905224169fe3c91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fb57b4c914b49b509fa00940a401c5c |
| publicationDate |
2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009252799-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
A method of manufacturing a semiconductor device that can be efficiently manufactured without creating a void in a sealing portion between a semiconductor element and a printed circuit board. A sealing material disposing step of disposing a sealing material 2 on at least one of a terminal forming surface of a semiconductor element 3 and a terminal forming surface of a printed circuit board 5 and a reduced pressure of 13300 Pa (absolute pressure) or less, A sealing step of pressing and integrating the wiring circuit board 5 and the semiconductor element 3 in a state where the terminals 5a of the wiring circuit board 5 and the terminals 3a of the semiconductor element 3 are opposed to each other with the sealing material 2 therebetween. And a terminal connection step for connecting the terminals 3a and 5a by heating and melting at least one of the terminals 5a of the wired circuit board 5 and the terminals 3a of the semiconductor element 3 under atmospheric pressure. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012074636-A |
| priorityDate |
2008-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |