http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009250843-A

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publicationDate 2009-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009250843-A
titleOfInvention Piezoelectric vibrator, temperature sensor, and temperature measuring method
abstract Conventionally, a thermocouple has been widely used for the temperature measurement of a wafer in the diffusion or oxidation process of a semiconductor process, but the thermocouple cannot directly measure the temperature by directly contacting the wafer. In particular, temperature variation between wafers could not be measured, so high-precision temperature measurement could not be performed. A small temperature sensor comprising a piezoelectric vibrator and a coil is directly attached to a wafer, and measurement data is transmitted wirelessly to a transmission / reception device disposed outside a semiconductor manufacturing apparatus. It is now possible to measure temperature variations within and between wafers. In addition, we decided to use LTGA as the material of the piezoelectric vibrator. It became possible to perform temperature measurement stably and accurately even in the high temperature range of 1000-1300 ℃. [Selection] Figure 1
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