| abstract |
Optically useful as an LED encapsulant that emits light of a short wavelength, and can provide a cured product having excellent heat resistance, light resistance, moisture absorption, adhesion, and colorless transparency and sufficient strength. An epoxy resin composition for an element sealing material is provided. SOLUTION: (A) component: alicyclic epoxy resin, (B) component: rubbery polymer particles, and (C) component: acid anhydride, modified acid anhydride, and cationic polymerization initiator 1 type or 2 or more types of hardening | curing agents chosen are contained, Content of (A) component is 100-50 mass% with respect to all the epoxy resin components, Content of (B) component is all the epoxy resin components An epoxy resin composition for an optical element sealing material, wherein the light transmittance at a wavelength of 400 nm of a cured product having a thickness of 2 mm ± 0.2 mm is 70% or more based on 1% by mass. [Selection figure] None |