http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242737-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 |
filingDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f242fc2d6f1ec5e988d14471819bc99 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a5628d2f8155be4ae3a143fd9c560db |
publicationDate | 2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2009242737-A |
titleOfInvention | Thermosetting resin composition, method for producing the same, and copper-clad laminate |
abstract | The present invention provides a thermosetting resin composition having excellent heat resistance, good electrical characteristics, and greatly improved brittleness, and a method for producing the same. A resin composition comprising a resin (A) before thermosetting having a dihydrobenzoxazine structure represented by general formula (IV) and a resin (B) after thermosetting. Embedded image [In General Formula (IV), Ar 1 represents a tetravalent aromatic group, R 1 represents a hydrocarbon group which is a residue of diamine, and n represents an integer of 2 to 500. ] [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017088561-A1 |
priorityDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 119.