http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242685-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fde159adff1c4a0ecf44731b06339816 |
| publicationDate | 2009-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009242685-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | [PROBLEMS] To suppress void generation and moisture resistance required as a resin for sealing a semiconductor chip, and to keep a fillet height low even in a thin chip, so that a heating jig and a resin are in contact with each other. There is provided an epoxy resin composition for sealing which is used in a mounting process by a pressure welding method of a semiconductor chip, which has a uniform fillet shape and excellent sealing properties. A solid phenol novolac resin or a naphthol novolak resin (B) with respect to an epoxy resin (A) has a number of moles of phenolic hydroxyl groups relative to the number of moles of epoxy groups in the above (A). The ratio of 0.3 times the trialkyltetrahydrophthalic anhydride (C) is 0.6 to 2 times the number of moles of acid anhydride groups relative to the number of moles of epoxy groups in (A). An epoxy resin composition for semiconductor encapsulation in resin pre-flip type flip chip mounting, which is contained in a ratio of 1.2 times. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014013970-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014013970-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9963587-B2 |
| priorityDate | 2008-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.