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filingDate 2008-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2009-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009235177-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device
abstract An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation that provides a semiconductor device having excellent moisture resistance reliability and a semiconductor device using the same. [Solution] An epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin, a curing agent, an inorganic compound containing a carbonate of a layered double hydroxide, and an inorganic filler different from the inorganic compound. At this time, the inorganic compound is preferably an inorganic compound represented by the following general formula (1). Mg a M b (OH) 2a + 3b-2c (CO 3 ) c · mH 2 O (1) (In the formula, M is a transition metal, 4 ≦ a ≦ 8, 1 ≦ b ≦ 3, 0.5 ≦ c ≦ 2, and m is an integer of 0 or more.) [Selection] Figure 1
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