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filingDate 2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f447366fd426b24701237bcf058585bc
publicationDate 2009-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009229657-A
titleOfInvention Photosensitive resin composition and laminate
abstract [PROBLEMS] To provide good compatibility when producing a dry film, exhibiting the same sensitivity when exposed with both i-line and h-line type exposure machines, and excellent in resolution and adhesion, and developed with an alkaline aqueous solution. Provided is a photosensitive resin composition. (A) A thermoplastic copolymer containing an α, β-unsaturated carboxyl group-containing monomer as a copolymerization component and having an acid equivalent of 100 to 600 and a weight average molecular weight of 5,000 to 500,000. 20-90% by mass, (b) addition polymerizable monomer having at least one terminal ethylenically unsaturated group: 5-75% by mass, (c) photopolymerization initiator containing triarylimidazolyl dimer: 0. A photosensitive resin composition comprising 01 to 30% by mass, and (d) a specific pyrazoline compound: 0.001 to 10% by mass, and having (b) at least one terminal ethylenically unsaturated group A photosensitive resin composition, wherein the addition polymerizable monomer contains a specific addition polymerizable monomer. [Selection figure] None
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