| abstract |
Disclosed is an epoxy resin composition for semiconductor encapsulation, which does not use a brominated epoxy resin or an antimony compound, and is excellent in flame resistance and fluidity and solder resistance at a low cost. An epoxy resin composition for semiconductor encapsulation, comprising (A) an epoxy resin having an indene skeleton, (B) a curing agent, and (C) an inorganic filler, and the semiconductor encapsulation thereof A semiconductor device comprising a semiconductor element sealed with a cured product of an epoxy resin composition for fastening. [Selection figure] None |