http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009203290-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_217f357cdf25f5b68f965728040b8ef0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate | 2008-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a9821f1387b67d9b0298af12720dd6c |
| publicationDate | 2009-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009203290-A |
| titleOfInvention | Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device |
| abstract | An epoxy resin composition for encapsulating an optical semiconductor having light transmission necessary for optical transmission of an optical semiconductor device such as a photocoupler and excellent in reflow resistance and moisture absorption solder heat resistance, and light using the same A semiconductor device is provided. An epoxy resin composition for sealing an optical semiconductor comprising an epoxy resin, a curing agent, and an inorganic filler as essential components, wherein a dicyclopentadiene type epoxy resin is used as the epoxy resin in an amount of 5 to the total amount of the epoxy resin. The molten spherical silica is contained as an inorganic filler in an amount of 80 to 90% by mass based on the total amount of the epoxy resin composition for sealing an optical semiconductor. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016157860-A |
| priorityDate | 2008-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.