| abstract |
An aqueous composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a copper wiring metal is provided. An aqueous composition comprises an oxidizing agent, an inhibitor of copper wiring metal, 0.001 to 15% by weight of water-soluble modified cellulose, a non-sugar water-soluble polymer, 0 to 15% by weight of a complexing agent of copper wiring metal, phosphorus Contains 0-15 wt% compound, 0.05-20 wt% acid compound capable of complexing with copper ions, and water; the solution has an acidic pH. [Selection figure] None |