| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2008-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e34d9964d16ac480afc9cfa022082f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42b88310c8d112aac2d1a531768befbd |
| publicationDate |
2009-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009194195-A |
| titleOfInvention |
Semiconductor device and manufacturing method thereof |
| abstract |
Provided is a Cu wiring forming method in which Cu elution does not occur during CMP when a Ru material is used as a barrier metal film for Cu wiring. A step (d) of removing a second barrier metal film (Ru film) formed on the first barrier metal on the upper surface of the interlayer insulating film, and after the step (d), the first and And (e) depositing a seed copper (Cu) film on the second barrier metal film. Thus, by removing the second barrier metal film on the upper surface before forming the seed copper film, the copper effect of this second barrier metal film and copper elutes into the slurry. To prevent. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013504886-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011066274-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012074608-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102414804-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011033920-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011114989-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011216867-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7339486-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101347430-B1 |
| priorityDate |
2008-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |