| abstract |
In hole bonding, it is important to accurately measure a ball pressure bonding thickness when setting a bonding strength to a desired value. However, the relatively flat part of the peripheral part of the ball that has been crimped due to the miniaturization of the ball is becoming narrower. It has become increasingly difficult to measure. In the manufacturing process of a semiconductor device, the present invention stores, in advance, the diameter of the inner chamfered portion outer circumference of the capillary tip as data, and refers to the data to measure the ball crimp thickness. The height of the ball portion corresponding to the outer periphery of the inner chamfered portion is measured. [Selection] Figure 21 |