| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate |
2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_393209989cfab7baa7bcdb4b8b9404a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3e6463283a618c8f3b0f4a429351d2d |
| publicationDate |
2009-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009188398-A |
| titleOfInvention |
Manufacturing method of air gap in microstructure |
| abstract |
A microscopic air gap is formed by decomposition of a sacrificial film material by diffusion through a film of a chemical etching solution. A method for manufacturing at least one air gap in a microstructure includes: (a) providing a microstructure with at least one gap filled with a sacrificial material, wherein the gap is an impermeable membrane. A step of covering and defining at least a part of the surface with a film 33 that can be converted into a permeable film by the action of a chemical etching solution having the property of decomposing the sacrificial material, and (b) permeable the film 33. (C) removing the chemical etching solution from the microstructure, wherein the chemical etching solution is hydrofluoric acid and / or Including a step of being a fluid containing ammonium fluoride. [Selection] Figure 3B |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102196500-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102222037-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200117681-A |
| priorityDate |
2008-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |