http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009173782-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B26F1-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B26F1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2008-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86b271c9ddb2203b2babbdfe2994f1cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40bdfca18ca8e0d05e7a069817f3dee5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_953c0c11e6023718bfc41487f696eaf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83c9f92e878b43a248e227a987a9c448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd764fcf610357e1f7ebedf32b4ba54f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d296cef402099b61ca6e9876c10beb8b |
| publicationDate | 2009-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009173782-A |
| titleOfInvention | Manufacturing method of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| abstract | An epoxy resin having two or more epoxy groups in one molecule, a curing agent which is a phenol resin having two or more hydroxyl groups in one molecule, an inorganic filler and carbon black for semiconductor encapsulation The epoxy resin composition is filtered from the carbon black coarse particles that do not pass through the 20 μm mesh from the mixed liquid obtained by mixing the raw material carbon black, a part or all of the curing agent, and the organic solvent. The solvent is removed to prepare a pre-mixture of a part or all of the curing agent and carbon black, and the pre-mixture and the remaining components are kneaded. [Effect] According to the method for producing an epoxy resin composition for semiconductor encapsulation of the present invention, it is excellent in reliability and moldability, and particularly when used as a semiconductor device for fine pitch wiring, the gold wire flow, leakage failure, etc. It is possible to provide an epoxy resin composition for semiconductor encapsulation that gives a cured product with less occurrence of electrical property defects. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018177858-A |
| priorityDate | 2008-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.