| abstract |
A system for polishing one or more layers of a multi-layer substrate having a first metal layer and a second layer is provided. The system of the present invention comprises (i) a liquid carrier, (ii) at least one oxidizing agent, and (iii) at least one polishing additive that increases the rate at which the system polishes at least one layer of the substrate. And (v) a polishing pad and / or an abrasive, wherein the polishing additive is pyrophosphate, condensed phosphate, phosphonic acid and salts thereof, amine, amino alcohol, amide, imine, imino acid, nitrile , Nitro, thiol, thioester, thioether, carbothiolic acid, thiocarboxylic acid, thiosalicylic acid, and mixtures thereof. The present invention also provides a method for polishing a substrate comprising contacting the system with the surface of the substrate and polishing at least a portion of the substrate with the system. [Selection figure] None |