Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00 |
filingDate |
2008-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f9dc7ae7f4538730388f8debca1132d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cdcf669408d90b3e87d343b3ff8fb80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b0fe0f246082c07738d036b23c9c70c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_494d883a0131ab109ee63f32bb3e8246 |
publicationDate |
2009-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009167523-A |
titleOfInvention |
Conductive substrate for plating, method for producing the same, method for producing conductor layer pattern or substrate with conductor layer pattern using the same, substrate with conductor layer pattern, and translucent electromagnetic wave shielding member |
abstract |
The present invention provides a conductive substrate for plating capable of more uniform plating, and enables a substrate with a conductor layer pattern to be produced with high productivity using a transfer method. A conductive base material for plating 1 comprising a base material and a conductive diamond-like carbon film or a conductive inorganic material film formed on the surface of the base material, preferably a conductive diamond-like surface on the surface. A conductive base material 2 on which a carbon film or a conductive inorganic material film is formed, and an insulating layer 3 formed on the surface of the conductive diamond-like carbon film or the conductive inorganic material film. An electroconductive substrate for plating in which a recess 4 for forming a wide plating in the opening direction is formed. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014118582-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101681485-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102246536-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015122301-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102055405-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015124437-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011068941-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011068940-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011068943-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019009526-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015076180-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190011097-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190004491-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016223006-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014105374-A |
priorityDate |
2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |