http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009167375-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-073 |
filingDate | 2008-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_197e0b293cc995c6cf2c6ca9dd8e1d61 |
publicationDate | 2009-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2009167375-A |
titleOfInvention | Thermosetting resin composition, molded product, cured product, cured molded product, and electronic device including them |
abstract | The present invention relates to a thermosetting resin composition containing a curing agent for dihydrobenzoxazine resin, which has a high effect of promoting ring-opening polymerization of dihydrobenzoxazine resin and is excellent in compatibility, safety and cost. The purpose is to provide goods. The present invention relates to a heat containing 0.1 to 30 parts by weight of a p-hydroxybenzoic acid ester per 100 parts by weight of a resin having two or more dihydrobenzoxazine ring structures in the molecule. A curable resin composition is provided. [Selection] Figure 1 |
priorityDate | 2007-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 166.