| abstract |
Provided is a hard disk substrate manufacturing method including a polishing step capable of suppressing the waviness of a substrate surface and improving the polishing rate. The method includes a step of polishing a substrate to be polished using a polishing liquid composition containing alumina particles, silica particles, and water, and the standard deviation of the number basis of the particle size of the silica particles is 11 to 35 nm. The manufacturing method of the hard-disk board | substrate whose polishing load in the said grinding | polishing is 10.3-16.7kPa. [Selection figure] None |