| abstract |
[PROBLEMS] To provide excellent insulation and hardly generate a residue when forming a hole for wiring by laser processing or the like, and even when left at a high temperature or subjected to a thermal cycle, peeling or cracking occurs. Provided are an insulating material that gives a hard-to-occur hardened material, an electronic component device using the insulating material, and a manufacturing method thereof. An insulating material for an electronic component device, comprising a curable compound (A), a curing agent (B), an inorganic filler (D1) having an average particle size of 3 to 8 μm, and an average particle size. Containing 0.1 to 2 μm of inorganic filler (D2), including inorganic fillers (D1) and (D2) in a volume ratio (D1: D2) in the range of 9: 1 to 1: 1, and insulating An electronic component device 1 having an insulating material containing inorganic fillers (D1) and (D2) in a total range of 50 to 90% by volume in 100% by volume of the material, and an insulating layer 4 made of a cured product of the insulating material. And its manufacturing method. [Selection] Figure 1 |