| abstract |
A plating bath and method for depositing a uniform and glossy metal layer having good physico-mechanical properties on a substrate. A heteroatom-containing organic compound that prevents decomposition of the plating bath additive having the following formula is incorporated into the plating bath: R1-X-R2 (X is -S (O) n-S (O ) P-S (O) q-S (O) u-S (O) v-S (O) w-,-(S (O) z) m- (CH2) y- (S (O) z ' ) M′-, or —SO 2 —S— (CH 2) y —S—SO 2 —, n, p, q, u, v, w, z and z ′ are each independently an integer from 0 to 2, m and m ′ is independently an integer from 1 to 6, y is an integer from 2 to 4, or a heteroatom selected from S, O, N, or N substituted with a (C1-C6) alkyl or tosyl group R1 and R2 together with the atoms to which they are attached can form a 5- to 18-membered heterocycle). [Selection figure] None |