| abstract |
The present invention provides a composition having a low viscosity suitable for potting electronic parts and forming a silicone gel having a low density and high thermal conductivity after curing. The thermally conductive silicone gel composition of the present invention comprises (A) 100 parts by weight of polyorganosiloxane having an average of 0.1 or more alkenyl groups bonded to silicon atoms in one molecule, and (B) 1 A polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms in the molecule, the hydrogen atom in this component is 0.1 to 4.0 per alkenyl group in the component (A), and And (C) a catalyst amount of a platinum-based catalyst, and (D) boron nitride having an average particle size of 20 to 180 μm, respectively, in an amount of 30 to 60% by weight of the entire composition. This composition has a viscosity (23 ° C.) of 0.5 to 10 Pa · s. [Selection] Figure 1 |