http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009147345-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76254
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2008-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_226b0623e1fd46157094502505e2f94b
publicationDate 2009-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009147345-A
titleOfInvention Thin layer transfer method
abstract A method for realizing a thinning method is provided in which a substrate to be thinned is bonded onto a temporary, easily removable support. The initial substrate (1) is bonded to one surface (25) of a silicon-type polymer layer (20), and the one surface is subjected to ultraviolet treatment, and the initial substrate (1) is thinned. A thin layer (5) is formed on the silicon type polymer layer (20). [Selection] Figure 2C
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140082780-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016524312-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101991389-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012146695-A
priorityDate 2007-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.