| abstract |
The present invention seeks to provide a curable underfill encapsulation composition that is particularly effective in non-flow underfill encapsulation processes. The present invention provides one or more selected from the following components: a) one or more epoxy resins, b) polysebacic acid polyanhydride, polyazeline acid polyanhydride and polyadipic acid polyanhydride A plurality of linear polyanhydrides, c) one or more cyclic anhydrides, and d) one or more catalysts, wherein the ratio of the linear polyanhydrides to the cyclic anhydrides Is stoichiometric), a non-flow underfill encapsulation material comprising. [Selection] Figure 1 |