| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08 |
| filingDate |
2008-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6d9767bb01c0dc7537030428a9fb4f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f61d0cb264ce0985e4cdf35be8262e7 |
| publicationDate |
2009-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009141368-A |
| titleOfInvention |
Multilayer ceramic package |
| abstract |
An object of the present invention is to provide a multilayer ceramic package having a cavity in which an electronic component is mounted and capable of controlling a precise dimension while suppressing shrinkage during firing inside the cavity. One side surface of a multilayer ceramic package having a cavity 16 on which an electronic component 15 is mounted is laminated on a ceramic substrate 11 having a conductive pattern formed therein, and the plane shrinkage of itself upon firing. The first ceramic layer 12 having a characteristic that the rate is less than 1% and the first ceramic layer are stacked so as to have a cavity in which an electronic component can be accommodated, and differ from the firing shrinkage rate of the first ceramic layer. A multilayer ceramic package including a second ceramic layer 13 having a firing shrinkage rate. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020202942-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020202942-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160070122-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102066153-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7140271-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170085605-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020202943-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020202943-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101954126-B1 |
| priorityDate |
2007-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |