http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009141089-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2007-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fde4fd988a7ca334d0ca3711f1f0f28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_366c0fbf63526c6a8b6d8595243bfc0e |
| publicationDate | 2009-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009141089-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | The present invention relates to a bump plating process for forming a gold bump electrode of about 15 to 20 μm in a semiconductor product such as an LCD driver. There is provided a method for preventing the height of the bump from being increased and forming the bump height uniformly on the wafer. In forming a gold bump on a semiconductor wafer by electroplating, an insulating annular shielding plate having an elliptical central opening is disposed between an anode electrode and the wafer. . [Selection] Figure 1 |
| priorityDate | 2007-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.