| abstract |
An object of the present invention is a plate-like material that can easily peel off an object to be pasted from a plate-like member, and can prevent peeling / lifting between the plate-like member and the object to be pasted even under high temperature. A double-sided pressure-sensitive adhesive sheet for member processing is provided. A base material, a first adhesive layer 3 laminated on one surface of the base material 2 and a hard support substrate 6 is pasted thereon, and a semiconductor wafer laminated on the other surface of the base material 2 7 is a double-sided pressure-sensitive adhesive sheet 1 having a second pressure-sensitive adhesive layer 4 to which 7 is applied, and the first pressure-sensitive adhesive layer 3 is reduced in mass at 150 ° C. by thermogravimetry (TG). A silicone compound having a rate of 20% or less is contained. [Selection] Figure 1 |