| abstract |
Provided is a photosensitive resin composition having high resolution and high adhesiveness, and further having low developer stain resistance and plating solution stain resistance and excellent contrast immediately after exposure. (A) A thermoplastic copolymer containing an α, β-unsaturated carboxyl group-containing monomer as a copolymerization component and having an acid equivalent of 100 to 600 and a weight average molecular weight of 5,000 to 500,000. : 20-90% by mass, (b) addition polymerizable monomer having at least one terminal ethylenically unsaturated group: 5-75% by mass, (c) photopolymerization initiator comprising a specific oxime compound: 0.01- A photosensitive resin composition containing 10% by mass and (d) leuco dye: 0.05 to 10% by mass. [Selection figure] None |