| abstract |
To provide an adhesive member for a semiconductor, which is significantly improved in workability with respect to adhesive residue on a wafer ring of an adhesive which has been a problem of an adhesive member for contacting a semiconductor element. An adhesive member comprising an adhesive layer and a base material layer, wherein the adhesive layer comprises (A) an epoxy resin and an epoxy resin curing agent, and (B) one or more in the molecule. A high molecular weight component having a functional group and a weight average molecular weight of 100,000 or more, (C) a proton donating compound, (D) a photoradical generator, and (E) an inorganic or resin having an average particle size of 1 to 350 nm An adhesive member for semiconductor, comprising fine particles. [Selection] Figure 1 |