| abstract |
The present invention provides a copper pillar-tin bump and a method of forming the same, which enables high-density packaging by reducing the pitch of the copper pillar-tin bump by a fine pattern manufactured through exposure of a photoresist. As a copper pillar-tin bump formed on a semiconductor chip, the copper pillar-tin bump includes a copper layer formed on the chip, and a tin that entirely covers an upper portion and a side portion of the copper layer. The copper layer includes a first copper layer formed on the chip and a copper pillar layer formed on the first copper layer to constitute a copper pillar-tin bump. [Selection] Figure 1 |