| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e5db580deca7130dbe51805c6c608b35 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40 |
| filingDate |
2007-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d2d88576d15adc19578a4e976b17b4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1d3d1b364a01ae7be164af54b7fb68 |
| publicationDate |
2009-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009123986-A |
| titleOfInvention |
Multilayer circuit board manufacturing method |
| abstract |
Provided is a technique capable of making an insulating resin layer surface smoother in a multilayer circuit board and applying a laser via forming method satisfactorily. In a method of manufacturing a multilayer circuit board having an insulating resin layer and a wiring layer on a support substrate, a copper foil is adhered to the insulating resin layer using an adhesive, and the free surface of the copper foil is bonded to a heterocyclic ring. A via hole that penetrates the copper foil and reaches into the insulating resin layer is formed by laser treatment with the compound that contains the compound. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111690957-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7222951-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11690178-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115846885-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014130997-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017094470-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021028165-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111690957-A |
| priorityDate |
2007-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |