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publicationDate 2009-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2009123791-A
titleOfInvention Method for forming conductive thin wire
abstract It is an object of the present invention to provide a method for forming a high-definition conductive fine wire free from bleeding at a low cost. After forming a resin film having a hardness of 20 to 70 according to a JIS-K-6253 type A measurement method on the surface of a resin substrate, the resin film is made conductive by using an intaglio printing or stencil printing technique. Form a fine line pattern with paste, or form a fine line pattern with electroless plating catalyst ink using intaglio printing or stencil printing technique, and then form a thin line pattern to form a metal film on the fine line pattern by plating treatment By doing so, a conductive fine wire is formed. [Selection figure] None
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