http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009120959-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_755326c3256ca01dfa89196823ddb1a1 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C19-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-10 |
filingDate | 2009-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea8bfda767a8ff490faed6d8fa0bdf8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_640a7f4766b02b141ad680d2e92c60a6 |
publicationDate | 2009-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2009120959-A |
titleOfInvention | High purity nickel alloy target |
abstract | PROBLEM TO BE SOLVED: To provide a high-purity nickel or nickel alloy target for magnetron sputtering capable of improving film uniformity (film thickness uniformity) and plasma ignition (ignition) characteristics even in a manufacturing process using a 300 mm wafer. And a method for manufacturing the same. A high-purity nickel or nickel alloy target for magnetron sputtering, wherein the target has a magnetic permeability of 100 or more, and the sputtered film has excellent uniformity in sputtering. target. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014043614-A |
priorityDate | 2009-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.