| abstract |
Materials useful for forming chip stacks, bonding chips and wafers, and thinning wafers, and methods of using such materials are provided. A surface of a substrate is coated with a photosensitive polymer having a weight average molecular weight of 10,000 to 500,000, and a development pattern is obtained after removing volatiles. In the developing process, the portion 20 where the polymer is not removed and the gap portions 30, 40 where the polymer is removed are formed and baked. The bonding pad 50 is exposed. Another structure such as lamination is formed using the coated substrate by a curing process. In the curing process, for example, the crosslinking is continued in the first curing step, and the second curing step completes the bonding at a higher temperature. [Selection] Figure 1 |