http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009111146-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7af673589ca45d2fd8b9ea902cdbd1dc |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
| filingDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a89361a546e92023cc66291f3eecf7c6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c8881f16df9832d14a947bf5ccadce9 |
| publicationDate | 2009-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009111146-A |
| titleOfInvention | Semiconductor chip and manufacturing method thereof |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor chip manufactured by a manufacturing method including a process of cleaving by a dicing process using laser light, and capable of preventing separation of a minute piece of a modified region from a fractured surface of the semiconductor chip A chip and a manufacturing method thereof are realized. In a compound forming step after cleaving a wafer, a semiconductor substrate after cleaving into semiconductor chips is placed in a chamber in which compound formation is performed with the semiconductor substrate being attached to a sheet. Subsequently, air is introduced into the chamber, and ultraviolet rays are irradiated onto the split surface 21d from above the wafer 20 by a low-pressure mercury lamp. Thereby, the fractured surface 21d is oxidized by oxygen excited by ultraviolet rays to form a silicon oxide 21e. Since the chemical bonding force between the fractured surface 21d and the modified region K can be increased by the oxide 21e, it is possible to prevent the modified region K from being scattered as fine pieces. [Selection] Figure 4 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112838135-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112838135-B |
| priorityDate | 2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.